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| STANDARD APPLY | ANSI H35.2-2013 EN755/GB5237.1-2017 | |
| CERTIFICATION | ISO9001:2008 | |
| SURFACE TREATMENT | Mill finish/Silver anodized/Black anodized/frozen anodized/PVDF Coating/Powder coating/3D Wooden Paint | |
| COLOR | Clearner/Matt | Silver, bronze, champagne, etc. |
| The anodized film thickness 10um -25Um | ||
| Powder coating | White, Black, Grey,Green, Blue, Yellow ,Red and etc. | |
| The powder coated thickness is over 80um. | ||
| Wood Grain | 1. USA and Italian MENPHIS transfer printing paper. | |
| 2. AKZO NOBEL INTERPON D1010(10 years warranty): Australia ceder, Bush cherry, Chest nut, Jarrah I, Jarrah II, Western red ceder, etc. | ||
| 3. AKZO NOBEL INTERPON D34(5 years warranty): Bush wood, Western red, Jarrah, Snow gum, etc. | ||
| Electroph oresis | Silver , black , champagne , etc | |
| Brushed | Silver, nickel, golden yellow, black, bronze, etc | |
| PVDF Coating | White, Black, Grey,Green, Blue, Yellow ,Red and etc. | |
| 3D Wooden Paint | Solid wood handle 3D wooden paint, White , Black, Grey,Green, Blue , Yellow ,Red and etc. | |
| DEEP PROCESSING | 90degree, 45degree and any degree Cutting, punching, drilling, bending, weld, mill, CNC, etc. | |
| Windowdoor/fenster | Sliding, awning, casement, thermobreak window/door | |
| Aluminum with glass | Clearm float, laminated, tempering, Low-E Coated glasses | |
| OEM | Customized aluminium profiles are available. | |
1. Product: Aluminum profile - heat sink
2. Brand: V global
3. Aimed: A key material used for rapid heat dissipation in the field of electronic and electrical equipment.
1. Material Advantages: It has excellent thermal conductivity, enabling it to quickly absorb and conduct heat. With strong corrosion resistance, it can adapt to various complex environments and is not easily damaged.
2. Design Highlights: It has a circular radial structure with multiple fins, greatly increasing the heat - dissipation surface area. The fins are evenly distributed with reasonable gaps, which is conducive to air flow and enhances heat - dissipation efficiency.
3. Performance: It has a high thermal - conduction efficiency, quickly dissipating the heat generated by the equipment. The structure is stable and can withstand certain external impacts without being easily deformed.
4. Installation Methods: It is closely connected and fixed to the heat - generating components of electronic devices using bolts or thermal conductive silicone. The installation operation is convenient.
1. Computer Hardware: Used for CPU heat sinks, graphics card heat sinks, etc., to ensure the stable operation of computer hardware and prevent performance degradation due to overheating.
2. Communication Equipment: For heat dissipation of equipment such as base stations and switches, ensuring the continuous and normal operation of communication equipment.
3. Lighting Equipment: Such as heat dissipation for high - power LED lights, extending the service life of lamps.
1. Efficient Heat Dissipation: The unique multi - fin design and excellent material significantly enhance the heat - dissipation ability, effectively solving the overheating problem of equipment.
2. Convenient Installation: The simple installation method allows for quick adaptation to various heat - generating components, saving installation time and costs.
3. Strong Compatibility: It is suitable for the heat - dissipation needs of a variety of electronic and electrical devices, with high versatility and the ability to meet heat - dissipation requirements in different scenarios.
